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Intel Core2 Duo L7700 SLAES Mobile CPU Processor Socket P PGA LV 1.8GHz 4MB 800MHz

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$75.00$95.00

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Additional information

Weight 49 g
CPU Socket Type

,

Condition

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Condizione

Model Number

Socket Type

CPU Speed

Brand of Product

Computer Tyrp

Features & Compatibility

 

 


Intel Mobile Core Duo L7xxx series LV CPU for Socket P

This item have  “PGA or BGA” type, after ordered and advise, please

Brand: Original Intel

Model:Intel® Core? Duo L7700

Setp Code:SLAES 

(ES Final / Show Version Same as Original Exactly)

Step Type:Socket P (For Intel 965/GM45/PM45)

Condition:Refurbished

Warranty: DOA 30Days

(If removed RMA sign or sticker, no warranty)

Payment: Paypal or T/T (Bank Transfer)

  

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Product Description

 

Intel® Core? Duo Mobile Processor L7700

 

General information

Type     CPU / Microprocessor
Family     Intel Core 2 Duo Mobile
Model number       L7700
CPU part number     LE80537LG0334M (SLAES)
Frequency (MHz)       1800
Bus speed (MHz)       800
Clock multiplier       9
Package     479-ball micro-FCBGA
1.38″ x 1.38″ (3.5 cm x 3.5 cm)
Introduction date     Sep 5, 2007
   
 
Architecture / Microarchitecture

Processor core     Merom
Core stepping     G0 (QXMR, SLAES)
Manufacturing process     0.065 micron
Data width     64 bit
Number of cores     2
Floating Point Unit     Integrated
Level 1 cache size       2 x 32 KB instruction caches
2 x 32 KB write-back data caches
Level 2 cache size       shared 4 MB

Features    

    * MMX instruction set
    * SSE
    * SSE2
    * SSE3
    * Supplemental SSE3
    * EM64T technology 
    * Execute Disable Bit technology 
    * Virtualization Technology
    * Dynamic Acceleration technology 

Low power features    

    * Stop Grant mode 
    * Sleep mode 
    * Deep Sleep mode 
    * Deeper Sleep mode 
    * Enhanced Deeper Sleep mode 
    * Dynamic Cache sizing
    * Enhanced SpeedStep technology 
    * Dynamic FSB frequency switching

 
Electrical/Thermal parameters

V core (V)       0.9 – 1.2
Minimum/Maximum operating temperature (°C)      0 – 100
Minimum/Maximum power dissipation (W)       3.3 (Enhanced Deeper Sleep mode) / 27.6
Thermal Design Power (W)       17

 

 
 
 
 

 

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